*HEADING
 USER SUBROUTINE GAPCON, TEMP DEP
*NODE,NSET=PLANEA
1, 
3,,,1.
5,,1.,1.
7,,1.
*NCOPY,CHANGE NUMBER=100,OLD SET=PLANEA,SHIFT,NEW SET=PLANEB
1.,0.,0.

*NCOPY,CHANGE NUMBER=300,OLD SET=PLANEA,SHIFT,NEW SET=PLANED
1.,0.,0.

*NSET, NSET = BC1
1,3,5,7
*NSET, NSET=BC2
301,303,305,307
*ELEMENT,TYPE=DC3D8,ELSET=ONE
1,101,103,105,107,1,3,5,7
*surface,type=node, NAME=NODCON
301,1.0
303,1.0
305,1.0
307,1.0
*ELSET, ELSET=BLOCK
**ONE,TWO
ONE, 
*surface, NAME = SURF1
ONE, S1
*CONTACT PAIR, INTERACTION = GAP
NODCON,SURF1
*SOLID SECTION,ELSET=BLOCK,MATERIAL=BLOCK
*MATERIAL,NAME=BLOCK
*CONDUCTIVITY
10., 
*SURFACE INTERACTION, NAME=GAP
** tabulated clearance dependent gap conductance not present
*GAP CONDUCTANCE,USER
*STEP, UNSYMM=YES
*HEAT TRANSFER,STEADY STATE
.25,1.,.25,.25
*BOUNDARY
BC1,11,11,1000.
BC2,11,11
*EL PRINT,FREQ=0
*EL FILE,FREQ=0
*OUTPUT,FIELD,FREQ=0
*ELEMENT OUTPUT
*NODE PRINT
NT, 
*NODE FILE
NT, 
*OUTPUT,FIELD
*NODE OUTPUT
NT,
*CONTACT PRINT
*CONTACT FILE
*OUTPUT,FIELD
*CONTACT OUTPUT,VARIABLE=PRESELECT
*END STEP